R&D CENTRE

NanoFLEX was founded in 2005 to develop advanced technologies for the manufacture of flexible substrate in the FPC and IC packaging sector. One of the key technologies is a plasma based process for the fabrication of adhesiveless copper on flexible substrates. The R&D Centre is situated in KL, Malaysia. We work closely in collaboration with a local university.

The objective is to leverage the latent R&D capability and talents with the entrepreneurial experience of the founding team.